| |
As a fabless
company, ID MOS has engaged close partnerships with major actors of the microelectronics
industry in order to provide the widest offer for circuits production.
FOUNDRY
|
Special agreements with a selection of european and far-east foundries.
Wide
choice of processes available from 0.13µm to 2.0µm in CMOS,
BiCMOS, High-voltage...
Representation
of foundry services in eastern europe with FABLESS
|
| |
Foundry process portfolio 
|
| ELECTRICAL
TEST
|
Wafer probing and IC final testing at FABLESS
in eastern Europe.
Dedicated Test & Reliability engineering and services
|
| |
Test capabilites 
|
| IC
PACKAGING
|
CEI, SIGNETICS and CARSEM for
standard pastic Assembly.
Flip-chip, chip-on-board and hybrid assembly capabilities. |
| |
Package portfolio 
|
| SILICON
ENGINEERING
|
Fast prototyping and low-volume digital ASIC services with CHIPEO
/ CHIP EXPRESS.
Semiconductor advanced expertise with SERMA TECHNOLOGIES.
|
|