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IC PACKAGING

For production, ID MOS offers a wide selection of packaging in plastic or ceramic assembly. All assembly lines show ISO9000 and QS9000 cerfication, and a state-of-the-art quality monitoring which garantees life-time product reliability.

Families
Pin count
Package type
Options
MICRO 3 to 8 SOT - SC
-

SOP 8 to 56 SOIC - TSOP - TSSOP

- Thermal

- SiP

- Stacked die

QUAD 10 to 240 TQFP - PQFP - MQFP

ARRAY 16 to 900 TBGA - PBGA - µBGA
LCC 28 to 84 PLCC
CSP 3 to 64 TQFN - MLP - PLLP

..... and many more

 

 

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