IC PACKAGING

For production, ID MOS offers a wide selection of packaging in plastic or ceramic assembly. All assembly lines show ISO9000 and QS9000 cerfication, and a state-of-the-art quality monitoring which garantees life-time product reliability.

Families		Pin count	Package type	Options
	MICRO	3 to 8	SOT - SC	-
	SOP	8 to 56	SOIC - TSOP - TSSOP	- Thermal - SiP - Stacked die
	QUAD	10 to 240	TQFP - PQFP - MQFP
	ARRAY	16 to 900	TBGA - PBGA - µBGA
	LCC	28 to 84	PLCC
	CSP	3 to 64	TQFN - MLP - PLLP

..... and many more