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TEST
CAPABILITIES FOR WAFER AND PACKAGED IC _____________
ID
MOS uses multi-site test capabilities for IC manufacturing. Wafer probing
and IC final test are performed with regards to product quality and cost compromise.
In-process yield monitoring is performed for cost continous improvement. High
and Low temperature testing is also available.
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Probers |
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Electroglass |
EG1034X |
Testers |
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Wentworth |
AWP1050 |
| Tektronix |
S3270 |
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| Schlumberger |
S15
S92 |
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| Minato |
M9200 |
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Handlers |
| IMS |
XL2
XL100 |
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Temptronic |
TP452A |
| Teradyne |
A370 |
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Multitest |
MT8704
MT8501
MT8203
MT8202
MT8503 |
| Applicos |
ATX7002 |
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