Search
Close this search box.

Standard products

Technological bricks

ID MOS makes available a catalog of standard circuits dedicated to specific application segments:

  • Power Factor correction (PFC)
  • RFID – Intelligent transponders in the UHF RF range
  • Capacitive sensing drivers (Touch Screen devices)
  • Standard circuits re-designed to address obsolescence issues

Those circuits are made available to our customers as such, but they may also be used as demonstrators to be used for further ASIC customizations.

That approach brings several benefits in the global development process:

  • The key functions may be physically verified, removing the associated development risk
  • Some pre-development target may be built, allowing software/hardware co-development

Intelligent energy management (PFC)

Power Factor Correction (PFC) eliminates most of the disturbance generated on the mains and controls the phase difference between the current and the voltage supplying the load, therefore seen as a pure resistor from the distribution network.

PE 4201 :

  • Operating Mode CRM/DCM
  • Download link available here

PE 4301 :

  • Operating Mode CCM
  • Download link available here

Smart transponders

PE 3001
  • Passive transponder chip according to EPC Class 1 Generation 2 UHF RFID version 1.0.9
  • Energy provided for communication through the RF field, energy for the data monitoring provided through a battery
  • Temperature measurement and storage including a time stamp in the integrated non-volatile EEPROM
  • Intelligent power management for the different power domains
  • 8kBit EEPROM can be written and read through the RF field and the data monitor
  • Fully integrated system without any need of external devices (antenna and battery only)
  • Extra signal output for “out-of-limits” temperature detection
  • Continuous battery control and automatic shut down
  • Extended battery supply voltage range for single or dual cell supply
  • Password protection for monitoring data according to EPC Gen 2 Protocol
  • Additional functionality possible through SPI interface (μC, external Sensors)
  • Passive transponder chip according to ISO15693
  • Temperature measurement and storage including a time stamp in the integrated non-volatile EEPROM
  • Energy for communication provided through the RF field, energy for the data monitoring provided through a battery
  • Power management for the different power domains
  • 8kBit EEPROM can be written and read through the RF field and the data monitor
  • Fully integrated system without any need for external devices (antenna and battery only)
  • Extra signal output for “out-of-limits” temperature/external sensor detection
  • Continuous battery control and automatic shut down
  • Extended batterysupply voltage range for single or dual cell supply
  • Password protection for monitored data
  • Data monitor for internal and/or external sensor or only for user defined data
  • Implementation of external analogue sensors (X,Y) over a differential interface
    • Normal measurement function for capacitive sensors
    • Interrupt function with user defined variables and sampling
  • Additional functionality possible through SPI (μC, external sensors)

Download link available here

Capacitive sensing​

PE 5004
  • Sensing of up to 100 capacitive touch sensors
  • Controllable stimulation for wide spread of suitable sensor capacitance, layout and material
  • Highly sensitive, coatings of over 30mm possible
  • Very low acquisition time of 10ms for 100 sensors in a matrix
  • High resolution of 10bit for each sensor capacitive changes of less than 5fF detectable
  • Standby mode with programmable wake up intervals
  • Low operating current
  • Low-Power Mode for large Sensor shapes
  • Very low current during deep sleep (1μA)
  • No need for grounding of scanned object
  • No need for sampling capacitors or external resistors
  • High sensitivity to large parasitic capacitances
  • Very robust against noise
  • Temperature drift compensation
  • Multiple sensor arrays and PE5004 chips controllable with one μC
  • 12Bit sigma delta converter
  • Two channels
  • Each channel has the possibility for differential or singled-ended measurements
  • Implemented calibration routine for both channels
  • Internal offset capacitance
  • SPI slave
  • Low conversation time
  • Possibility for external excitation frequency input
  • TSSOP16 package

Redesign of standard IC

Standard components re-design to solve obsolescence problems.

On the basis of golden parts and the specification of the original component, ID MOS has the ability to re-design pin-to-pin replacements of obsolete products using up-to-date technologies, having the same function and form-factor. That approach is dedicated to catalog products and makes available for long years a “clone” of a component previously obsoleted (see below a list of available components developed in the course of that activity).

The methodology uses a validation on the target application through a mock-up board built around an FPGA, to be validated by our customers in their actual application environment.

The same approach may be used for FPGA portages or re-design of obsolete ASICs. The objective remains the same except that the input supplied by the customer may be much more comprehensive, including VHDL, netlists and test-bench. Please note that, in the specific case of FPGA portages, the re-programing feature cannot be available.

Such cloning of purely analog devices is also a possibility ID MOS may offer.

Discover more

For any question: